fabricatiON OF robust electrothermal MEMS with customizable thermal response time and power consumption requirements 

Motivation/Objectives:
  • Devices actuated by electrothermal bimorphs provide large displacement, e.g. micromirrors that can scan large angles are used for biomedical imaging
  • SiO2 is often used as thermal isolation to minimize power consumption. The brittle nature of SiO2 increases susceptibility to impact failure.
  • For metal-SiO2 bimorphs, the low thermal diffusivity of SiO2 results in slow thermal response
  • A fabrication process that allows engineers to custom design thermal isolation at one or both ends of the actuators can be used to trade-off power requirements for speed and vice versa.
Approach:
  • Material pairs with widely different thermal expansion coefficients and high thermal diffusivity are shortlisted. Three material pairs stand out — Al-DLC, Al-Invar, Al-W. Al-W was chosen to form the bimorphs.
  • W also acts as a resistive heater.
  • High temperature polyimide was chosen for thermal isolation as it has low thermal conductivity.
Results:
  • Micromirrors were fabricated on SOI wafers.

Fig. 1 (a) One-dimensional (b) Two-dimensional micromirrors actuated by Al-W bimorphs


Fig. 2 (a) dc characteristic
(b) frequency response of mirror shown in Fig.1(a)

  • Robustness of the new designs were compared with older designs that are actuated by Al-SiO2 bimorphs. The two-ball setup shown in Fig. 3 was used to generate single impact events.


Fig. 3 Impact test setup schematic
(a) before impact (b) after impact.When Ball-2 is raised and released, a single impact occurs between the two balls.

  • The new devices could withstand accelerations in excess of 4000g. The  new mirrors >4 times more robust than Al-SiO2 based designs.
Publications and Patents:
  • S. Pal, H. Xie, “Fabrication of robust electrothermal MEMS with fast response”, UF.945P (Pending)
  • S. Pal, H. Xie, “A PROCESS FOR FABRICATING ROBUST ELECTROTHERMAL MEMS WITH CUSTOMIZABLE THERMAL RESPONSE TIME AND POWER CONSUMPTION REQUIREMENTS”, submitted to Transducers 2011

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